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You can still place order on website but all the orders will be shipped after our CNY holidays, and the delivery time will count from 2nd, Feb.

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Product name:
Industrial control board

 

Characteristic:
1, the board design integration is very high;
2, the need to use composite surface treatment method, gold finger plating hard gold 30 uinch;
3, gold finger position plate thickness tolerance 1.6mm+/-0.10mm, it is recommended that customers in the design of the gold finger corresponding to the inner line of the copper block, in order to facilitate the plate thickness tolerance control.

 

Specifications:
Layer count: 6
Board thickness: 1.60mm
Base materials: FR4 S1141
Finished size: 172*148mm
Surface finish: Gold Plated + finger
Line width/line space: 5/5mil
Minimum hole: 0.25mm
Solder resist color: blue
Cu thickness: inner layer 1 OZ outer layer 1 OZ

Product name:
Thick copper board

 

Characteristic:
Prominent features: the outer layer of copper thickness of 6 OZ, the inner product of copper thickness 6 OZ, commonly used in large power equipment.
Processing difficulties:
1, inside and outside the need to increase the thickness of copper thickness of 2 OZ or more by electroplating method;
2, before pressing the need to fill in the inner layer of resin;
3, the inner and outer layer circuit is difficult to etch;
4, solder resist the need for multiple printing.

 

Specifications:
Layer count: 4
Board thickness: 3.0mm
Base materials: FR4 S1000-2
Finished size: 175*104mm
Surface finish: 沉金
Line width/line space: 12/12mil
Minimum hole: 0.5mm
Solder resist color: Sensitive green
Cu thickness: inner layer 6 OZ outer layer 6 OZ

Product name:
Data acquisition board

 

Characteristic:
1, the integration of the board design is very high, thick diameter ratio of more than 10:1, heavy copper plating is difficult;
2, the use of TG 170 plate production.

 

Specifications:
1, the integration of the board design is very high, thick diameter ratio of more than 10:1, heavy copper plating is difficult;
2, the use of TG 170 plate production.
Layer count: 8
Board thickness: 4.0mm
Base materials: FR4 S1000-2
Finished size: 400*400mm
Surface finish: mmersion
Line width/line space: 5/5mil
Minimum hole: 0.35mm
Solder resist color: Sensitive green
Cu thickness: inner layer 1 OZ outer layer 1 OZ

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